According to a recent report from New Electronics, DRAM and Flash memory could be the only successful new memory-related technologies in recent years. The report said many technologies have been developed and pushed toward the market, but none of them have established the reliability, cost-efficiency or sustainability of DRAM or Flash.
As a result, if you are purchasing a new computer you can rest assure that your DRAM will remain valuable for the device's entire life cycle without being completely replaced by a new technology. However, you may need to adjust your notions of purchasing a traditional hard disk drive, because Flash memory technology is allowing solid state drives to become an important part of the hardware market.
SSDs use flash memory to read and write data stored on the device, allowing them to operate at faster speeds than traditional hard disks, which depend on a mechanical device rotating a disk that uses lasers to read and write data. As a result, SSDs are quickly becoming somewhat standard in laptops. The desktop market for SSDs is not necessarily as responsive because the moving parts of a hard drive are not as much of a factor in desktop models. However, SSDs are becoming popular boot drives to improve system startup and overall speeds.
The New Electronics report estimates Flash memory still has about 10 years remaining in its mainstream life cycle. The architecture behind the technology has become cheap enough to manufacture efficiently and sell to mainstream users, and devices that favor SSDs, such as laptops and mobile platforms, are becoming more popular. However, new technologies have the potential to emerge within the 10-year period that could challenge Flash's current stronghold.
One of those challenges, the report said, is the result of an upgrade to current Flash models that uses vertical 3D construction to improve memory capacity. Flash devices work by sending electric signal through small transistors that use the signal to read and write content. Current Flash architecture involves transistors places side-by-side on a memory chip. This not only limits storage capacity, it also allows the electric signal to be disrupted because transistors are closely packed.
According to New Electronics, researches have successfully developed new techniques to essentially stack transistors on top of one another in a vertical, 3D stack. As a result, the disruption between parts of the chip is removed and space limitations associated with horizontal construction is gone. The new method of constructing Flash memory is in the early stages of development, but the report said it could end up offering significant benefits for both the speed and reliability of Flash memory devices.
The report said the 3D method of constructing Flash memory could extend the production life of Flash technologies, such as solid state drives, beyond the 10-year period currently predicted for the technology. Furthermore, this manufacturing technique could keep other new memory-related technologies at bay, keeping Flash-based tools relevant.
According to recent research released by the Bedford Report, 3D Flash memory is already becoming an important tool for high-end Flash devices, and could become mainstream within the next few years. The report said 3D Flash construction makes the chips less expensive than current current Flash technology, which could provide significant benefits to consumers looking for a new memory solution.
Currently, the next technology is most popular in mobile computing devices, the Bedford Report said, but it could develop into a mainstream memory solution that enhances the benefits of Flash memory.
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